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Atmel Corp
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Part No. |
AT61162ENBSP AT61162E
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OCR Text |
.../O (0:7) A (0:16) WE OE CS1 CS2 Chip 0 Chip 1 CS1 CS2
Bank 1 I/O (0:7) A (0:16) WE OE Chip 1 CS1 CS2
Bank 7 I/O (0:7) A (0:16) WE OE Chip 1 CS1 CS2
I/O (0:7) A (0:16) WE OE
CS1 CS2 Chip 0
I/O (0:7) A (0:16) WE OE
CS1 CS2 C... |
Description |
Radiation Hard 2Mbit x 8 SRAM Cube From old datasheet system
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File Size |
215.22K /
14 Page |
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Atmel Corp
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Part No. |
TSC21020FNBSP TSC21020F
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OCR Text |
Chip Harvard Architecture Maximizes Signal Processing Performance 50 ns, 20 MIPS Instruction Rate, Single Cycle Execution 60 MFLOPS Peak, 40...Immune Total Dose Better Than 100 Krad (Si) SEU Immunity Better Than 50 MeV/mg/cm2 For 25 MHz Specif... |
Description |
32-bit floating point DSP rad and SEU hardened From old datasheet system
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File Size |
867.69K /
51 Page |
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Aeroflex Circuit Technology
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Part No. |
5962-0153201QYX 5962D0153201QYX 5962L0153201QYA 5962L0153201TYA 5962L0153201TYC 5962L0153201TYX 5962L0153201QYC 5962L0153201QYX 5962-0153201QYA 5962-0153201QYC 5962-0153201TYX 5962D0153201TYC 5962D0153201QYC 5962P0153201TYA
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OCR Text |
... is provided by an active low chip enable ( e n), an active low output enable ( g ). this device has a power-down feature that reduces power consumption by more than 90% when deselected . writing to each memory is accomplished by taking... |
Description |
1024K8 SRAM: SMD. 25ns access time, 3.3V operation. QML class Q. Lead finish factory option. Total dose none. 1024K8 SRAM: SMD. 25ns access time, 3.3V operation. QML class Q. Lead finish factory option. Total dose 1E4(10krad(Si)). 1024K8 SRAM: SMD. 25ns access time, 3.3V operation. QML class Q. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)). 1024K8 SRAM: SMD. 25ns access time, 3.3V operation. QML class T. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)). 1024K8 SRAM: SMD. 25ns access time, 3.3V operation. QML class T. Lead finish gold. Total dose 5E4(50krad(Si)). 1024K8 SRAM: SMD. 25ns access time, 3.3V operation. QML class T. Lead finish factory option. Total dose 5E4(50krad(Si)). 1024K8 SRAM: SMD. 25ns access time, 3.3V operation. QML class Q. Lead finish gold. Total dose 5E4(50krad(Si)). 1024K8 SRAM: SMD. 25ns access time, 3.3V operation. QML class Q. Lead finish factory option. Total dose 5E4(50krad(Si)). 1024K8 SRAM: SMD. 25ns access time, 3.3V operation. QML class Q. Lead finish hot solder dipped. Total dose none. 1024K8 SRAM: SMD. 25ns access time, 3.3V operation. QML class Q. Lead finish gold. Total dose none. 1024K8 SRAM: SMD. 25ns access time, 3.3V operation. QML class T. Lead finish factory option. Total dose none. 1024K8 SRAM: SMD. 25ns access time, 3.3V operation. QML class T. Lead finish gold. Total dose 1E4(10krad(Si)). 1024K8 SRAM: SMD. 25ns access time, 3.3V operation. QML class Q. Lead finish gold. Total dose 1E4(10krad(Si)). 1024K8 SRAM: SMD. 25ns access time, 3.3V operation. QML class T. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
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File Size |
95.93K /
14 Page |
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MAXIM INTEGRATED PRODUCTS INC MAXIM - Dallas Semiconductor MAXIM[Maxim Integrated Products] Maxim Integrated Products, Inc.
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Part No. |
MAX6410 MAX6407 MAX6406 MAX6408 MAX6409BS45-T MAX6409BS44-T MAX6409BS42-T MAX6409BS41-T MAX6410BS46-T MAX6410BS45-T MAX6410BS44-T MAX6406BS24-T MAX6406-MAX6411 MAX6411BS45-T MAX6406BS MAX6406BS22-T MAX6406BS23-T MAX6406BS25-T MAX6406BS26-T MAX6406BS27-T MAX6406BS28-T MAX6406BS29-T MAX6406BS30-T MAX6406BS31-T MAX6407BS MAX6408BS MAX6409BS MAX6409BS33-T MAX6409BS34-T MAX6409BS35-T MAX6409BS36-T MAX6409BS37-T MAX6409BS38-T MAX6409BS39-T MAX6409BS40-T MAX6409BS43-T MAX6409BS46-T MAX6410BS33-T MAX6410BS34-T MAX6410BS35-T MAX6410BS36-T MAX6410BS37-T MAX6410BS38-T MAX6410BS39-T MAX6410BS41-T MAX6410BS42-T MAX6410BS43-T MAX6411BS MAX6411BS33-T MAX6411BS34-T MAX6411BS35-T MAX6411BS36-T MAX6411BS37-T MAX6411BS38-T MAX6411BS39-T MAX6411BS40-T MAX6411BS41-T MAX6411BS42-T MAX6411BS43-T MAX6411BS44-T MAX6410BS40-T MAX6411BS46-T MAX6410BS MAX6407BS31-T MAX6408BS23-T MAX6408BS24-T MAX6409 MAXIMINTEGRATEDPRODUCTSINC.-MAX6406 MAXIMINTEGRATEDPRODUCTSINC-MAX6409BS34-T
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OCR Text |
Chip-Scale Package
General Description
The MAX6406-MAX6411 is a family of ultra-low power circuits used for monitoring battery, power-supp...Immune to Short VCC Transients o No External Components
MAX6406-MAX6411
Ordering Information
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Description |
Voltage Detectors in 4-Bump (2 x 2) Chip-Scale Package VoIP Ringing SLIC; Temperature Range: 0°C to 70°C; Package: 28-PLCC VoIP Ringing SLIC; Temperature Range: 0°C to 70°C; Package: 28-PLCC 1-CHANNEL POWER SUPPLY SUPPORT CKT, PBGA4 ITU CO/PABX SLIC with Low Power Standby; Temperature Range: 0°C to 70°C; Package: 28-PLCC Round Conductor Flat Cable, 3754/50 30 AWG, .025 (0.64) Round Conductor Flat Cable, 3754/34 30 AWG, .025 (0.64) Round Conductor Flat Cable, 3754/20 30 AWG, .025 (0.64) Low-Capacitance 3-Channel /-15KV ESD-Protection Array for High-Speed Data Interfaces 5-SOT -40 to 85 Round Conductor Flat Cable, 3754/68 30 AWG, .025 (0.64) 700-mW Mono, Differential Input, Class-AB Audio Amplifier with Active Low Shutdown 24-BGA MICROSTAR JUNIOR -40 to 85 1-CHANNEL POWER SUPPLY SUPPORT CKT, PBGA4
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File Size |
142.07K /
8 Page |
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Atmel
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Part No. |
TSC21020F 21020F
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OCR Text |
... Floating-Point-Processor D Off-Chip Harvard Architecture Maximizes Signal Processing Performance D 50 ns, 20 MIPS Instruction Rate, Single-...immune D Total dose better than 100 Krad (Si) D SEU immunity better than 50 MeV/mg/cm2 D For 25 MHz ... |
Description |
Radiation Tolerant 32/40?Bit IEEE Floating?Point DSP Microprocessor From old datasheet system
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File Size |
485.14K /
37 Page |
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Price and Availability
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