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AEROFLEX[Aeroflex Circuit Technology]
Aeroflex, Inc.
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| Part No. |
ACT4468DI ACT4468DF ACT4468D ACT4468DFI
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| OCR Text |
...o Case Temperature Rise for the hottest Device Thermal Resistance, Junction to Bottom of Case -55C to +125C -65C to +150C -0.3 V to +7.0 V 10 V 5 V 650 mA 2 Watt
(Note: Normal operation conditions require one transmitter on and the other o... |
| Description |
ACT4468D Dual Transceivers for MIL-STD-1553 ACT4468D双收发器的MIL - STD - 1553
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| File Size |
79.76K /
6 Page |
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it Online |
Download Datasheet
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Atmel, Corp.
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| Part No. |
ACT-S512K32N-045F1Q ACT-S512K32N-045F2Q ACT-S512K32N-045P1Q ACT-S512K32N-025F2Q ACT-S512K32N-025F1Q ACT-S512K32N-055P1C ACT-S512K32N-055P1M ACT-S512K32N-055P7I ACT-S512K32N-055P7Q ACT-S512K32N-055P1T ACT-S512K32N-025P1Q ACT-S512K32N-017F18C
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| OCR Text |
...e power dissipation 3.0 w ? j-c hottest die, max thermal resistance - junction to case 5c/w v g maximum signal voltage to ground -0.5 to +7 v t l maximum lead temperature (10 seconds) 300 c normal operating conditions symbol parameter mini... |
| Description |
512K X 32 CACHE SRAM MODULE, 55 ns, CPGA66 1.385 X 1.385 INCH, 0.245 INCH HEIGHT, PGA-66
512K X 32 CACHE SRAM MODULE, 55 ns, CPGA66 1.085 X 1.085 INCH, 0.185 INCH HEIGHT, PGA-66
x32 SRAM Module X32号的SRAM模块
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| File Size |
196.63K /
9 Page |
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it Online |
Download Datasheet |
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Vishay
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| Part No. |
RWM
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| OCR Text |
... the surface temperature at the hottest point should not exceed 450 c. these aspects should be considered by the end user. enamelled wirewound power resistors axial leads electrical specifications tolerance standard 5% on request ... |
| Description |
Enamelled Wirewound Power Resistors, Axial Leads
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| File Size |
193.02K /
3 Page |
View
it Online |
Download Datasheet |
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