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Amphenol Communications Solutions |
| Part No. |
68690-130HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
92090-130LF
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| Description |
Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 30 Positions, 2.00mm (0.079in) Pitch..
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10065490-130TRLF
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| Description |
Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
78290-130HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90130-1218 0901301218
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| Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 18 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 18 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
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| File Size |
586.12K /
7 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
L17H2990130
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| Description |
Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 26/26 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90130-1216 0901301216
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| Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 16 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 16 Circuits, Black, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating
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| File Size |
586.11K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
69190-130HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90130-1250 0901301250
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| Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 50 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 50 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
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| File Size |
586.12K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
90130-3320 0901303320
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| Description |
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 20 Circuits, Black 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 20 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating
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| File Size |
168.61K /
4 Page |
View
it Online |
Download Datasheet |
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