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Amphenol Communications Solutions |
Part No. |
130-4182-11H
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Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Daughtercard Module, APP.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
71600-418LF
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Description |
Quickie IDC Receptacle, Wire to Board connector -Double row - 18Positions - 2.54 mm (0.100in) Pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
75844-304-18LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 18 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54121-411041850LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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IBM Microeletronics International Business Machines, Corp.
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Part No. |
IBM0418A80QLAB IBM0418A40QLAB
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Description |
8Mb( 512K x 18 ) SRAM(8Mb( 512K x 18 )同步CMOS静态RAM) 4Mb( 256K x 18 ) SRAM(4Mb( 256K x 18 )同步CMOS静态RAM) 4Mb的(256 × 18)的SRAMMb的(256 × 18)同步的CMOS静态RAM)的
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File Size |
26.41K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
78290-418HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
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Tech specs |
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Official Product Page
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IBM Microeletronics International Business Machines, Corp.
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Part No. |
IBM0418A8ACLAB IBM0436A4ACLAB
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Description |
8Mb( 512K x 18 ) SRAM(8Mb( 512K x 18 )寄存器锁存模式的同步CMOS静态RAM) 4Mb( 128K x 36 ) SRAM(4Mb( 128K x 36 )寄存器锁存模式的同步CMOS静态RAM) 4Mb的(128K的36)的SRAMMb的(128K的36)寄存器锁存模式的同步的CMOS静态RAM)的
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File Size |
29.76K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
57102-F04-18LF
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Description |
Minitek® 2.00mm, Board/Wire to Board Connector, 2.00mm (0,079in), Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
57102-S04-18LF
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Description |
Minitek® 2.00mm, Board/Wire to Board Connector, 2.00mm (0,079in), Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
57102-G04-18LF
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Description |
Minitek® 2.00mm, Board/Wire to Board Connector, 2.00mm (0,079in), Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68690-418HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 18 Positions, 2.54 mm (0.100in)Pitch.
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Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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